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| TS 69688 |
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TS69688 exemplifies TRANSMAT’s engineering and R&D CAPABILITIES. A true breakthrough material in
For Harsh environments
Idea solution of combination flux, high temperature, long process time under high-temp.
Proven material specifically formulated using aggressive flux and high temp upto 300 deg C.
Long life-span under
- Solder bath temp. maximum320 Deg C;
- Flux included-halides/interfux/AcidPre-heat;
- PCB Bottom Preheat exceeds 150 Deg C
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| Meet above three grades features |
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| Still also solution in Harsh environments |
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| Technical Data of TRANSMAT TS69688 |
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| Grade |
Flux Resistant |
Water Absorption (%) |
< 0.20 |
Parallelism |
0.1 |
| Colour |
Light Grey |
Chemical Resistance |
Excellent |
Thickness Tolerance |
± 0.10 |
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1.80 |
Flexural Strength
3 point support
(MPa) |
@ 23°C |
380 |
Modulus of
Elasticity
(MPa) |
@ 23°C |
18,000 |
| Sheet Size (mm) |
2440 x 1220 |
@ 150°C |
260 |
@ 150°C |
14,000 |
Thickness’
available (mm) |
5,6,8,10 |
@ 185°C |
150 |
@ 185°C |
10,000 |
Coefficient of Linear
Expansion (10-6/K)
between 30°C & 200°C |
11 |
Maximum Operating
Temperature (°C)
10 – 20 seconds |
380 |
Surface Resistivity (ohms) |
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Thermal Conductivity
(W/m°K) |
0.23 |
Standard Operating
Temperature (°C) |
300 |
Flatness Tolerance
(for a panel size of 300 x 300) |
0.2 |
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